ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

Tg170 Multilayer Board(3+4+3) HDI PCB Wearable Devices

♦ What is HDI PCB?

HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.

♦ Characteristics of HDI PCB

• • High circuit density
  • Miniaturization and thinness
  • Excellent signal integrity
  • Good heat dissipation performance
  • High reliability
  • A variety of laminate structures are available

♦ Applications of HDI PCB

Widely used in fields with high requirements on circuit board size, performance and reliability, such as smart phones, tablet computers, laptops, automotive electronics, medical equipment, aerospace, communication equipment, etc.

♦ Technical Parameters

♦ One-Stop PCBs Solution

 

PCB Prototype	Felx PCB	Rigid-Flex PCB	Ceramic PCB
Heavy Copper PCB	HDI PCB	High Frequency PCB	High TG PCB

 

 

 

♦ Advantages of DQS Team

1. On-time Delivery:  

• • Owned PCBA factories 15,000 ㎡
  • 13 fully automatic SMT lines 
  • 4 DIP assembly lines

 

     2. Quality Guaranteed:

• • IATF, ISO, IPC, UL standards 
  • Online SPI, AOI, X-Ray Inspection 
  • The qualified rate of products reach 99.9%

 

     3. Premium Service:

• • 24H reply your inquiry；
  • Perfect after-sales service system；
  • From prototype to mass production

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ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices Images